Ardent Concepts Webinars

Thursday December 3, 2020

@ 11:00AM/EST

Introduction to TR Multicoax Series

Key Takeaways from this Webinar:

• Learn about the benefits of high speed high density connectors that come in a variety of form factors

• Solderless compression mount technology allows these connectors to be reused across multiple programs and boards promoting exponential cost savings

• Superior signal integrity offered through 20 GHz, 40 GHz, and 70 GHz configurations to suit your bandwidth requirements


Thursday December 10, 2020

@ 11:00AM/EST

Introduction to SK Series Sockets

Key Takeaways from this Webinar:

• Learn how our industry-leading, high-performance contact technology delivers superior signal integrity and allows for the rapid testing of multiple integrated circuits using a single socket

• See how easy it is to install, remove, and reuse our sockets across multiple programs thanks to our solderless, compression mount technology

• Learn about how our sockets can save you time and money throughout the design and test process

Thursday December 17, 2020

@ 11:00AM/EST

Introduction to TR Multicoax Series

Key Takeaways from this Webinar:

• Learn about the benefits of high speed high density connectors that come in a variety of form factors

• Solderless compression mount technology allows these connectors to be reused across multiple programs and boards promoting exponential cost savings

• Superior signal integrity offered through 20 GHz, 40 GHz, and 70 GHz configurations to suit your bandwidth requirements

Thursday December 24, 2020

@ 11:00AM/EST

Introduction to CA Series Connectors and Interposers

Key Takeaways from this Webinar:

• Learn about the benefits of high speed high density connectors and the variety of scalable form factors Amphenol Ardent offers

• Solderless compression mount technology allows these connectors to be reused across multiple programs and boards promoting exponential cost savings

• How our CA Series connectors and interposers offer superior signal integrity and high density for applications like high speed backplane, mezzanine, edge card, and optical at a 0.4 mm pitch in a pure vertical interface – no offset required.