Upcoming Webinars

Key Takeaways from this Webinar:

• Learn about the benefits of high speed high density connectors and the variety of scalable form factors Amphenol Ardent offers

• Solderless compression mount technology allows these connectors to be reused across multiple programs and boards promoting exponential cost savings

• How our CA Series connectors and interposers offer superior signal integrity and high density for applications like high speed backplane, mezzanine, edge card, and optical at a 0.4 mm pitch in a pure vertical interface – no offset required.

Key Takeaways from this Webinar:

• Learn about the benefits of high speed high density connectors that come in a variety of form factors

• Solderless compression mount technology allows these connectors to be reused across multiple programs and boards promoting exponential cost savings

• Superior signal integrity offered through 20 GHz, 40 GHz, and 70 GHz configurations to suit your bandwidth requirements

Key Takeaways from this Webinar:

• Learn how our industry-leading, high-performance contact technology delivers superior signal integrity and allows for the rapid testing of multiple integrated circuits using a single socket

• See how easy it is to install, remove, and reuse our sockets across multiple programs thanks to our solderless, compression mount technology

• Learn about how our sockets can save you time and money throughout the design and test process

Key Takeaways from this Webinar:

• Learn about the benefits of high speed high density connectors that come in a variety of form factors

• Solderless compression mount technology allows these connectors to be reused across multiple programs and boards promoting exponential cost savings

• Superior signal integrity offered through 20 GHz, 40 GHz, and 70 GHz configurations to suit your bandwidth requirements

Key Takeaways from this Webinar:

• Learn about the benefits of high speed high density connectors and the variety of scalable form factors Amphenol Ardent offers

• Solderless compression mount technology allows these connectors to be reused across multiple programs and boards promoting exponential cost savings

• How our CA Series connectors and interposers offer superior signal integrity and high density for applications like high speed backplane, mezzanine, edge card, and optical at a 0.4 mm pitch in a pure vertical interface – no offset required.

Become an Expert in Measurement-Simulation Correlation for High-speed Serial Data Links

Join Teledyne LeCroy, Professor Eric Bogatin and Ansys to learn best practices and measurement and simulation processes critical in designing high-speed serial data links. The process and best practices will be described, and a well-characterized test device will be used with a measurement-simulation correlation to validate the process.

Topics to be covered in this webinar:

• The candidate test device to model and measure

• How to perform accurate S-parameter measurements

• Simulating the S-parameters for an interconnect structure

• Measuring the eye diagram with an oscilloscope

• The measurement simulation correlation process

PCIe^® 6.0 Preliminary FYI compliance and interoperability testing is expected to begin sometime around October 2023. Do you know what is changing? Will you be ready? Join Teledyne LeCroy as we focus on each electrical test, explain the background theory, test procedures and how passes and failures will likely be determined. We also describe what’s new, what’s the same as past generations, and how to avoid the most common test pitfalls.

Topics to be covered in this webinar:

• What’s New in PCIe 6.0 Compared to PCIe 5.0

• Transmitter Electrical Testing

• Transmitter Link Equalization Testing

• Receiver Link Equalization Testing

• PLL Bandwidth Testing

• Reference Clock Testing

Join Teledyne LeCroy for this 30-minute Oscilloscope Coffee Break Series to remind us how to get the most test and debug capability from our oscilloscopes. Grab your refreshment and spend a few minutes with us as we focus on a specific topic each month. Click here to access the entire series.

Part 12: Using Oscilloscope Pass/Fail Analysis for Productive Validation and Debug

Oscilloscopes contains a complex set of logic conditions and pass/fail result options that can be powerfully applied to speed debug and validation. In this webinar we describe how to test signals against a set of qualifying measurement conditions to establish either a “Pass” or “Fail” result.

Topics to be covered in this webinar:

• Definition and setup of waveform Mask testing

• Qualifying conditions for measurement parameters

• Setting pre-defined single-value or dual-measurement comparisons

• Configuring multiple queries

• Defining actions when qualifying conditions have or have not been met

Presented by: Stephen Murphy, Marketing Product Specialist / Applications Engineer

Can't attend live? Register anyway and you will receive an email with the recording and slides after the live event.